R.O. Vaishya

R.O. Vaishya
Department Production and Industrial Engineering
Designation Assistant Professor
Qualification Ph.D, PEC University of Technology
Research Interests Modern Manufacturing, CAD/CAM, CNC Machining, Hybrid (Additive+Subtractive),FRP
Email rahulvaishya@pec.edu.in ( Official )
rahul_mv@yahoo.com ( Personal )
Phone Number 0172-2753290 ( Resdence )

Sr. No. Title
1
2 Manjot Singh Randhawa, Rahul O Vaishya, Navneet Dua, A Steady Change From RFID To Facial Recongnition, International Journal Of Scientific & Technology Research Volume 8,Issue 11,November 2019, ISSN 2277-8616-3749
3 Manoj Kumar, RO Vaishya, NM Suri, Anurag Gupta, Parametric optimization of traveling wire electrochemical discharge machining (TW-ECDM) process for aspect ratio during machining of borosilicate glass, Materials Today: Proceedings, Elsevier
4 Anurag Gupta, Rahul Vaishya, Ranjeet Kumar, KLA Khan, Sandeep Chhabra, Ajay Singh Verma, Abhay Bharadwaj, Effect of drilling process parameters on delamination factor in drilling of pultruded glass fiber reinforced polymer composite, Materials Today: Proceedings, Elsevier
5 An experimental investigation of surface characterization for zirconia ceramic using electrochemical discharge machining process Arabian Journal for Science and Engineering 46 (3), 2269-2281
Sr. No. Society Duration
1 Indian Institute of Industrial Engineering (SMIIE 10087 (99)) Life Member
Sr. No. Recent Books
1 Manoj Kumar, Rahul Omprakash Vaishya, Narendra Mohan Suri, Machinability study of zirconia material by micro-ECDM, Manufacturing engineering, Springer,195-209
2 Rahul O Vaishya, Ankit D Oza, Anurag Gupta, Multiple Parameter Optimization by Wire Electrochemical Discharge Machining Process on Quartz Glass, Advances in Manufacturing Processes, Springer,71-86
3 Manoj Kumar, RO Vaishya, NM Suri, FEM-Based Thermal Modeling for Analyzing ECDM Process, Advances in Manufacturing Systems, Springer,213-225
4 Rahul Vaishya, Vivek Sharma, Vikas Kumar, Rajeev Verma, Smart Magnetorheological (MR) Finishing Technology and Its Applications, Proceedings of the International Conference on Industrial and Manufacturing Systems, Springer, Cham,677-685