Research Facilities

Sr. No. Image of Equipment Name of the Equipment Brief Description (key feature) of each Equipment Name of Faculty In-charge of the equipment Location Purchased from Institute fund/ Project grant/ others Status of Equipment (Working/Not Working)
31 Wire Electrical Discharge Machining (EDM) Wire Electrical Discharge Machining (EDM) Wire Electrical Discharge Machining (EDM) Wire electrical discharge machining (WEDM) uses a metallic wire to cut or shape a work piece. Dr. Uma Batra Biomaterials Lab DST (Department of Science & Technology) Working
32 TG/DTA/DSC Setaram Instrumentation KEP Technologies [Lab Sys Evo] 1600 oC TG/DTA/DSC Setaram Instrumentation KEP Technologies [Lab Sys Evo] 1600 oC TG/DTA/DSC Setaram Instrumentation KEP Technologies [Lab Sys Evo] 1600 oC Thermal analyzers typically measure heat flow, and weight loss, as a function of temperature. Dr. Uma Batra Biomaterials Lab Institute Fund Working
33 Solar simulator sciencetech Compact Solar Simulator-Class AAA Type Solar simulator sciencetech Compact Solar Simulator-Class AAA Type Solar simulator sciencetech Compact Solar Simulator-Class AAA Type

Solar simulators produce natural sunlight in quantifiable ways. Various applications of solar simulator include photoelectrochemical water splitting, water treatment and photoelectrochemical reduction of organic molecules.

Drr. Uma Batra / Dr. Anu Prathap M. U.

 Biomaterials Lab Institute Fund Working
34 Vacuum Arc Melting Cum Suction Casting Unit Vacuum Arc Melting Cum Suction Casting Unit Vacuum Arc Melting Cum Suction Casting Unit

Through the melting process, new materials, primarily metals and alloys, can be created with the help of this instrument by applying high electric current.

Max. Temp. = 3500℃
Sample Size = 50 gm x 4

Prof. Suresh Chand

 Particulate Metallurgy Lab & Alloy Development Lab Institute Fund Under Maintenance
35 Bottom Pouring Casting Furnace Bottom Pouring Casting Furnace Bottom Pouring Casting Furnace

This equipment is used to develop Aluminum and Magnesium Casting.

Maxium Temperature = 850℃

 Prof. Suresh Chand Particulate Metallurgy Lab & Alloy Development Lab Institute Fund Working
36 Horizontal Tube Furnace Metrex Scientific Instruments Private Limited Horizontal Tube Furnace Metrex Scientific Instruments Private Limited Horizontal Tube Furnace Metrex Scientific Instruments Private Limited

This equipment is used for studying the kinetics of roasting and calcinations of ores.

Tube Size:- ID= 70 mm
Horizontal Length = 200 mm
Overall Length= 700 mm
Max. Temp. =1500 ℃
Working Temp.= 1400 ℃

 Dr. Mahesh V. P. Mineral Engineering Lab Institute Fund Working
37 Mask Aligner- UV (405/365nm) ABM/6/350/NUV/SFM/M) Mask Aligner- UV (405/365nm) ABM/6/350/NUV/SFM/M) Mask Aligner- UV (405/365nm) ABM/6/350/NUV/SFM/M)

Ability to do patterning /lithography with semi-automatic capability.Minimum feature size of 0.8um and handle substrates upto 3 inch diameter. Ability to process mask sizes from 2.5”*2.5”upto 5”*5”.Split- field dual CCD camera with continuos video zoom with magnification upto 900

Maximum rotational speed 12000 rpm, Can store up to 30 recipes in internal memo-ry with unlimit-ed storage via USB drive

 Dr. Arun Kumar Singh Semiconductor Research Centre DST-FIST Working
38 Electron beam/thermal Evaporator (Hind High Vacuum Make) Electron beam/thermal Evaporator (Hind High Vacuum Make) Electron beam/thermal Evaporator (Hind High Vacuum Make)

Up to 6” Substrate holder. Ultimate vacuum of 5x10-7 Torr within 90 minutes. Electron Beam Gun with four pockets Can evaporate high melting point materials such as Mo and W Digital thickness monitor with ON/OFF operation for the deposition

 Dr. Arun Kumar Singh Semiconductor Research Centre DST-SERB Project Working
39 Plasma Enhanced Chemical Vapor Deposition (PECVD) (Hind High Vacuum Make) Plasma Enhanced Chemical Vapor Deposition (PECVD) (Hind High Vacuum Make) Plasma Enhanced Chemical Vapor Deposition (PECVD) (Hind High Vacuum Make)

Wide variety of material growth including high-k dielectrics , Capable of processing 4” substrate holder with heating up to 300⁰C, Processing at vacuum of 1x10-3 Torr, Fully automatic operation control using HMI

Dr. Arun Kumar Singh

 Semiconductor Research Centre DST-FIST Working
40 Reactive Ion Etching (RIE) Reactive Ion Etching (RIE) Reactive Ion Etching (RIE)

Capable to handle wafers up to 4” dia. Utilizes RF power of 600 watts at frequency 13.56 MHz with dark space shield to avoid parasitic plasma Electro-pneumatically controlled valves with interlocking Option to select different gases (maximum 4)

 Dr. Arun Kumar Singh Semiconductor Research Centre DST-FIST Working